ByAnatola Perna 2020-01-08 940
1, Supporting Low-profile, that is, narrow plate design, the system structure will be more compact;
2, For the movement of heat dissipation and air flow, the circuit layout of the motherboard has been optimized;
3, The installation of the motherboard will be easier, and the mechanical performance will also be optimized.
Moreover, BTX provides good compatibility. At present, there are several derivative versions of BTX, which are divided into standard BTX (325.12mm), microBTX (264.16mm) and Low-profile 's picoBTX (203.20mm) according to the width of the board, as well as future ExtendedBTX for servers. Moreover, the popular new buses and interfaces, such as PCIExpress and serial ATA, will also be well supported in the BTX architecture motherboard.
It is worth mentioning that the new BTX motherboard will optimize the heat dissipation system through pre-installed SRM (support and retention module), especially for CPU. In addition, the heat dissipation system is also called hot module in the terminology of BTX. In general, the module includes a radiator and an airflow channel. At present, there are two types of hot modules that have been developed, namely full-size and low-profile.
Thanks to the continuous application of new technology, the future BTX motherboard will completely cancel the traditional serial port, parallel port, PS/2 and other interfaces.
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