ByIngrid Wilhelmina 2019-05-30 316
In terms of specifications, the Helio M70 has a Cortex-A77 CPU accompanied by a Mali-G77 GPU, the ones recently announced by ARM a few days ago and which form the basis of future high-end smartphones. The M70 also includes its APU 3.0, an artificial intelligence processing unit.
For 5G connectivity, MediaTek has integrated a modem that promises speeds of up to 4.7 Gbps downstream and 2.5 Gbps upstream. The 5G modem features intelligent power saving and multi-mode support (2G, 3G, 4G and 5G), as well as dynamic power sharing to ensure better connectivity.
Other specifications include support for recording 4K video at 60 frames per second, as well as integration with cameras up to 80 megapixel resolution.
The Helium M70 has been manufactured under the FinFET process of 7 nanometers, which ensures lower energy consumption. MediaTek said it will offer the first samples to its customers during the third quarter of 2019, with a view to launching the first compatible phones during the first quarter of 2020.
The list of specifications has not yet been completed, so MediaTek announced that they will later release all information from the Helium M70. We will also know who will be the manufacturers that bet on MediaTek.
MediaTek's announcement comes after Huawei, Samsung and Qualcomm unveiled their respective chips with support for 5G. Unlike Qualcomm and its Snapdragon 855, MediaTek has integrated the 5G modem directly into the Helium M70's SoC.
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