BySigismondo Eisenhower 2019-08-20 510
The future iterations of AMD's ZEN microarchitecture rhyme above all with the promise of technological development leading to an even more successful exploitation of the 7 nm etching protocol. After taking advantage of the 14 and 12 nm nodes through its ZEN and then ZEN+ designs, AMD developed ZEN 2 to allow its new Ryzen processors to take advantage of the 7 nm engraving offered by the Taiwanese TSMC foundry. With ZEN 3 and potentially ZEN 4, Lisa Su's group wants to capitalize on this new engraving finesse... and it would be on the right track, says the specialized site KitGuru.
According to recent rumours, the reds have already completed the design phase of the future ZEN 3 architecture. According to TechPowerUp, the latter would be designed to make the best use of the 7nm extreme ultraviolet (EUV) lithography etching protocol. This should allow a further increase in the number of transistors on the chips and improved energy efficiency. Clearly, and not surprisingly, the next AMD processors (to be expected from 2020) could benefit from higher frequencies and even more generous performance than the current Ryzen 3XXX range.
According to KitGuru, AMD has moved into the design phase for its ZEN 4 architecture. It could be based on a completely revised version of the 7 nm EUV node, but it is especially on the 6 nm that AMD would bet with this design. This is the engraving process on which TSMC is currently working to eventually replace (or otherwise complete) its current 7nm offer.
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