ByEvelyn Garcia 2019-07-01 1033
According to AMD's new patent, the technical principle of "current cooling" is based on the "Peltier effect".
The Peltier effect refers to the phenomenon that when a circuit is supplied with current from different conductors, in addition to irreversible Joule heat, heat absorption and heat dissipation occur at the junctions of different conductors with different current directions. This was discovered in 1834 by J.C.A. Peltier.
AMD plans to insert a thermoelectric effect cooling module (TEC) into the center of the memory or logic chip of the 3D stack. With the Peltier effect, the upper and lower memory/logic chips above and below the thermocouple can be used independently of the higher temperature. The thermocouple withdraws heat and turns to the side with the lower temperature, which is then dissipated.
However, there are some problems with this design, that is, the electricity itself has the problem of better increase and heating, and this patent looks more like the hot spots are balanced to better concentrate the heat, thereby avoiding a single point of heat generation. Excessive problems occur.
In general, this technology is still in the patent stage and is brought to market through continuous research, development and testing. What is certain, however, is that AMD has made great progress under the leadership of Su Ma. This is the result that players want to see the most.
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