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1. 0.3mm micro channel injection process, high purity copper tube can quickly take away the high heat of CPU.
2. The hot water pass through the outlet of the water.
3. Internal silicone seal, high temperature resistance, aging resistance.
4. The installation way also breaks through the traditional lower backboard + screw + Spring + nut design, directly using metal backboard + screw design from the rear, which is convenient and more solid, and the bonding degree is higher and more stable.
(no quick wring joint).
Interface: G1/4 thread (actual size of outer diameter is 12.9MM, suitable for various types of interface)
Copper+POM High temperature resistant adhesive+Steel
Baseplate size: approx. 50x50mm/1.96x1.96''
Copper based materials: copper silver plating
For LGA 115x(1150 1151 1155 1156)